High volume, cost-sensitive markets like microcontrollers span a wide range of applications from toys and appliances to automobile electronics. Testing microcontrollers can only be done cost effectively when testing multiple devices in parallel at high parallel efficiency. Salland's X750 expands the J750 platform capability to meet evolving critical test requirements for high parallel efficiency, high power density and high measurement accuracy at both high and low voltages.
The X750 is an air-cooled backpack that mounts behind the J750
as pictured above. It is consistent with a tester-in-a-test-head
design. It consists of a power chassis, left and right signal
boards and 10 slots for additional instrument boards. Adding X750
DPS modules does not cause the loss of any of the digital or
special slots in the J750.
With the 10 additional instrument slots, users may add the following capabilities:
- Up to 640 independent device power supplies with voltage up to 8V
- Low current accuracy under 50nA ideal for IDDQ measurements
- 3 FV, 6 MI ranges and 16-bit resolution improve measurement accuracy
- 3 quadrant operation enables testing of on-board power supplies
- Programmable slew rates for better control of voltage overshoot
The X750 is compatible with the Teradyne J750 at both hardware and software level. Existing test programs, PIBs and probe cards are backward compatible. Our software for IG-XL makes development of multi-site applications fast and painless.