When software alone is not enough

An application project is a complex mixture of project management, intensive communication with chip designers, device and test specification, hardware interfacing, tester specific software, and debugging of both hardware and software. The final touch is given by the correlation, stability, documentation and installation at customer site.

At Salland Engineering, we have proven to be capable of handing this process to the utmost extent.

Salland Engineering is familiar with all prominent test equipment, such as Advantest, Agilent, Credence, LTX, Teradyne, SZ, and more. We are able to make conversions between all these tester types. This makes us extremely flexible. Anything is possible, from simple adaptions to conversions, from development of completely new programs to turn key project solutions for each test system. Any new tester platform is considered to be a new challenge.

Salland Engineering prefers working in a joint venture relationship, thus assuring the best result. This concept has been proven to be very successful. All of our projects are executed using a proven project approach that starts with an extensive project analysis of all the technical and other requirements for creating efficient test programs.

• Test Application and Test Engineering Support
  • Consultancy on DFT ( Design For Testability)
  • Conversion of programs from one tester platform to another tester platform
  • Test time reduction
    
  • Multi site testing
• Loadboard development
• Device characterization
• Pilot line and production test
• Quality and reliability
• Device packing QFP, QFN, special packages for MEMS, optical etc.
• Silicon failure analysis
• FIB IC repair
  
• Silicon reliability and environmental testing
  • HALT, ESD and latch up testing
    

Our main customers are ATE manufacturers and major electronic semiconductor manufacturers.

Salland Engineering has it own ATE equipment to debug the program in-house and to start-up the production already for low volumes.

This ATE equipment includes:

• Teradyne Flex-RF
• Teradyne uFlex
• Teradyne J750 512channel head
• Teradyne J750 1024channel head

Analogue

• Analogue switches
• OP AMP's
  
• MUX
• DEMUX
• Power FET
• Voltage regulators

Digital

• Microprocessors
• Micro controllers
• Peripheral devices: Disk controller, DMA interface, Parallel/Serial, Timers, Smart Cards

Memory

• EEPROM, FIFO, CACHE
• SRAM, DRAM, SIMS, VIDEO
• FLASH, RAMBUS
  

Mixed Signal

• Telecom: CODECS, MODEM, ISDN, SLIC, One chip telephone, base band, TIA, Multiplexers, WDM, SDH
• Multimedia: CD, DVD, CD RW, HDTV
• Automotive: Airbag controllers, ABS driver, Rain light detector, CAN bus
• SPACE: Navigation, Satellite
• Several: ADC, DAC