The wafer-map is being created on the SE-PROBE system. This concept results in time saving; due to multitasking communication. The wafer-prober is already send to the next die while SE-PROBE is doing map up-date and additional communication with the tester. By being in control of the wafer-prober touchdown reduction is provided for multi-side probing compared to original prober functionality. Reductions up to the 9% on touchdowns have been achieved. By using tester-daemons, also direct control over the tester is provided, but above all real-time parametric test-data is available within the application. With this Real-Time data access the SE-PROBE system becomes a Dynamic Test-cell Controller or DTC. DTC use the RT-data to control and optimize the test process. By monitoring for example a contact-resistance sensitive test, a probe-tip clean can be executed then when needed. This is different then a static/fixed setting on every so many touchdown/contacts, with DTC probe-tip clean is performed only then when the test values are showing a degrading behavior. Real time Statistical Process Control and “test-data validation” are good other examples of a powerful features offered by the DTC. Latest development of the software has added the full probe history in the wafer-map. This wafer-map is in Salland Engineering format and is being used as primary format during the wafer-probe process. Next to X/Y coordinates, hard-bin values, DTC will add a lot more relevant probe information to the map such as; the site number of a multi site probe-card touched each die, previous bin result when the die was retested, test and index time, where the process was paused and why, in case of on-line outlier detection being used the outlier details, where a probe-tip clean was performed. Also in an event log it is possible to trace back exactly what took place during the probe process. This information is also available in the system utilization tool and represents the OEE information for the test-cell. Right now the system offers the user to run the same product under different conditions without making a lot of changes, this is provided by it’s configurations capability. The high-light of the system is on production efficiency improvement and as a generic tool to stream-line the production. The “process-step” feature will watch over the right sequence of probe actions. Operator errors are reduced to zero. With access to Real-Time data the DTC also offers the capability to generate the tester data-log. In fact, data logging functionality can be switched off on the tester; DTC will generate the data-log without additional overhead. In a most cases DTC will be faster then the original. So wafer-map and tester data-log all come from 1 source the DTC. Most important added value in this case is full data integrity. To meet today’s wafer-probe requirements; Cost-effective, fast time to market, zero-defect, etc it is only possible by adding a test-cell controller. Salland Engineering DTC is the most powerful and cost effective tool on the market today. | 
Products 